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| Contamination of the wafer surface is the biggest problem in the semiconductor manufacturing process. Airborne particles emanating from humans or process equipment are a common cause of this contamination. Preventing this requires creating a unidirectional downward airflow. |
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| Optimal design based on computational fluid dynamics |
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| Sample calculation without shutter adjustment |
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| Sample calculation with shutter adjustment |
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| Using three-dimensional numerical analysis (k-e2 type model) and computer graphics technology, Taikisha performs simulations of airflow inside the booth. This allows easy design of the best configuration for the supply air plenum chamber and the degree of opening of the floor grating. |
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